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Product Introduction
SY-9404 Electronic Surfactant is an anionic fluorinated chemical surfactant that provides very low surface tension in low pH solutions, such as phosphoric acid/acetic acid/nitric acid mixtures for metal etching. Its very high surface activity can provide:
Improved wetting;
Excellent solubility;
High efficiency at low concentration;
Stable in water;
Filterability;
Main Applications
For metal etching solutions, including phosphoric acid/acetic acid/nitric acid ("PAN etching") mixtures, and other aqueous microelectronics process chemicals, such as applications in low pH solutions.
Components
Appearance | Clear liquid |
Fluorine modified acrylic acid sulfonic acid | 25% |
NMP | 75% |
proportion | 1.15 g/L |
Ion type | Anions |
pH | 4.5 |
Performance
Surface tension in different solutions dyne/cm
0ppm | 100ppm | 200ppm | 500ppm | 1000ppm | 2000ppm | |
water | 70 | 40 | 33 | 24 | 20 | 19 |
10%KOH | 77 | 38 | 30 | 25 | 22 | 18 |
50% H2SO4 | 67 | 39 | 29 | 24 | 21 | 19 |
40%HNO3 | 54 | 39 | 31 | 24 | 22 | 18 |
18.5M HCl | 63 | 36 | 29 | 23 | 22 | 19 |
85% H3PO4 | 78 | 38 | 28 | 24 | 21 | 19 |
1:50 NH4/H2O | 73 | 37 | 28 | 23 | 22 | 20 |
100:1 Hydrofluoric acid | 72 | 36 | 31 | 23 | 21 | 21 |
7:1 Buffered hydrofluoric acid A | 70 | 36 | 32 | 23 | 22 | 20 |
500:1Buffered hydrofluoric acid B | 56 | 38 | 31 | 24 | 23 | 20 |
A – 7 parts ammonium fluoride (40%) to 1 part hydrofluoric acid (49%) by volume
B – 500 parts ammonium fluoride (40%) to 1 part hydrofluoric acid (49%) by volume
* Surfactant concentration is based on active ingredient content. * Surface tension was measured using the Wilhelmy plate method according to ASTM D1331.
Surface tension in metal etching solution dyne/cm
content | 0ppm | 50ppm | 100ppm | 200ppm | 500ppm |
Etching solution1* | ~70 | 40 | 38 | 29 | 22 |
Etching solution 2* | ~65 | 40 | 39 | 28 | 21 |
** Metal etching solutions 1 and 2 are different proportions of phosphoric acid, nitric acid and glacial acetic acid, mainly used for aluminum etching
Product Safety and Disposal
SY-9404 surfactant is used in semiconductor wafer fabs and in the manufacture of solar panels and flat panel displays. The recommended method of disposal is high temperature incineration in a facility capable of handling halogenated materials. Release of surfactant SY-9404 to the environment must be prevented. Prevention includes, but is not limited to, disposal of aqueous waste streams containing surfactant. For additional product safety and handling information, read the product label and Material Safety Data Sheet before using this product.
