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Electronic chemical additives
SY-9406 Electronic surfactants

Product Introduction


SY-9406 Electronic Surfactant is a specially designed additive for improving the wettability of buffered hydrofluoric acid (BHF) or buffered oxide etch (BOE) solutions used in semiconductor, flat panel display, and solar cell applications. SY-9406 is an anionic fluorochemical surfactant with a 20% active ingredient in water. When used in BOE or BHF solutions, SY-9406 significantly reduces surface tension and improves the wettability of the solution, thereby enhancing the etching uniformity of BOE or BHF solutions with little to no impact on the etching rate. Consistent with semiconductor cleaning processes, SY-9406 has low metal content (typically less than 1 ppm for specific metals), and the solution can be filtered without affecting the surfactant's activity. SY-9406 has low adsorption on wafer surfaces and can be removed by a baking step after the etching process.

Main Features:

Improves the wettability of etching solutions

Minimal impact on etching rate

Dissolves in a wide range of BOE/BHF mixing ratios;

Low effective concentration;

Low metal content;

Filterable;

Low surface adsorption;

Surfactant activity can be removed by heating;

Low foaming;

Applications:

Cleaning or etching silicon, quartz, or glass surfaces in the manufacturing processes of semiconductors, flat panel displays, and solar cells;

Used in metal etching solutions, including phosphoric/acetic/nitric acid ("PAN etch") mixtures, as well as other aqueous microelectronics process chemicals, including low pH solutions.


Components

Ion type

Appearance

Clear liquid

Fluorine modified acrylic acid sulfonic acid

25%

NMP

75%

proportion

1.18 g/L

Anions


pH

4.5

Performance

Surface tension in different solutions dyne/cm


0ppm

100ppm

200ppm

500ppm

1000ppm

2000ppm

70

40

30

23

22

20

10%KOH

77

38

29

24

23

20

50% H2SO4

67

39

28

25

22

20

40%HNO3

54

39

29

25

23

20

18.5M HCl

63

36

29

26

23

21

85% H3PO4

78

38

28

26

22

22

1:50 NH4/H2O

73

37

29

25

23

21

100:1 Hydrofluoric acid

72

36

32

24

22

22

7:1 Buffered hydrofluoric acid A

70

36

31

25

21

21

500:1Buffered hydrofluoric acid B

56

38

29

25

22

22


Mixing Ratios:

A - 7 parts ammonium fluoride (40%) to 1 part hydrofluoric acid (49%) by volume

B - 500 parts ammonium fluoride (40%) to 1 part hydrofluoric acid (49%) by volume

  • The concentration of the surfactant is based on the active ingredient content.

  • Surface tension testing is conducted using the Wilhelmy plate method according to ASTM D1331.

tokens used: 13108, model: Grok-Beta(grok-beta)


 

Surface tension in metal etching solution dyne/cm

含量

0ppm

50ppm

100ppm

200ppm

500ppm

蚀刻液 1*

~70

26

25

24

24

蚀刻液 2*

~65

28

24

24

23

** Metal etching solutions 1 and 2 are different proportions of phosphoric acid, nitric acid and glacial acetic acid, mainly used for aluminum etching

 

Product Safety and Disposal

The SY-9406 surfactant is used in semiconductor wafer fabs and the manufacturing of solar cells and flat panel displays. The recommended disposal method is high-temperature incineration at facilities capable of handling halogenated materials. It is essential to prevent the release of SY-9406 surfactant into the environment. Preventive measures include, but are not limited to, handling aqueous waste streams containing the surfactant. For additional product safety and handling information, please read the product label and Material Safety Data Sheet (MSDS) before using this product.


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