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Product Introduction
SY-9406 Electronic Surfactant is a specially designed additive for improving the wettability of buffered hydrofluoric acid (BHF) or buffered oxide etch (BOE) solutions used in semiconductor, flat panel display, and solar cell applications. SY-9406 is an anionic fluorochemical surfactant with a 20% active ingredient in water. When used in BOE or BHF solutions, SY-9406 significantly reduces surface tension and improves the wettability of the solution, thereby enhancing the etching uniformity of BOE or BHF solutions with little to no impact on the etching rate. Consistent with semiconductor cleaning processes, SY-9406 has low metal content (typically less than 1 ppm for specific metals), and the solution can be filtered without affecting the surfactant's activity. SY-9406 has low adsorption on wafer surfaces and can be removed by a baking step after the etching process.
Main Features:
Improves the wettability of etching solutions
Minimal impact on etching rate
Dissolves in a wide range of BOE/BHF mixing ratios;
Low effective concentration;
Low metal content;
Filterable;
Low surface adsorption;
Surfactant activity can be removed by heating;
Low foaming;
Applications:
Cleaning or etching silicon, quartz, or glass surfaces in the manufacturing processes of semiconductors, flat panel displays, and solar cells;
Used in metal etching solutions, including phosphoric/acetic/nitric acid ("PAN etch") mixtures, as well as other aqueous microelectronics process chemicals, including low pH solutions.
Components
Appearance | Clear liquid |
Fluorine modified acrylic acid sulfonic acid | 25% |
NMP | 75% |
proportion | 1.18 g/L |
Anions | |
pH | 4.5 |
Performance
Surface tension in different solutions dyne/cm
0ppm | 100ppm | 200ppm | 500ppm | 1000ppm | 2000ppm | |
水 | 70 | 40 | 30 | 23 | 22 | 20 |
10%KOH | 77 | 38 | 29 | 24 | 23 | 20 |
50% H2SO4 | 67 | 39 | 28 | 25 | 22 | 20 |
40%HNO3 | 54 | 39 | 29 | 25 | 23 | 20 |
18.5M HCl | 63 | 36 | 29 | 26 | 23 | 21 |
85% H3PO4 | 78 | 38 | 28 | 26 | 22 | 22 |
1:50 NH4/H2O | 73 | 37 | 29 | 25 | 23 | 21 |
100:1 Hydrofluoric acid | 72 | 36 | 32 | 24 | 22 | 22 |
7:1 Buffered hydrofluoric acid A | 70 | 36 | 31 | 25 | 21 | 21 |
500:1Buffered hydrofluoric acid B | 56 | 38 | 29 | 25 | 22 | 22 |
Mixing Ratios:
A - 7 parts ammonium fluoride (40%) to 1 part hydrofluoric acid (49%) by volume
B - 500 parts ammonium fluoride (40%) to 1 part hydrofluoric acid (49%) by volume
The concentration of the surfactant is based on the active ingredient content.
Surface tension testing is conducted using the Wilhelmy plate method according to ASTM D1331.
tokens used: 13108, model: Grok-Beta(grok-beta)
Surface tension in metal etching solution dyne/cm
含量 | 0ppm | 50ppm | 100ppm | 200ppm | 500ppm |
蚀刻液 1* | ~70 | 26 | 25 | 24 | 24 |
蚀刻液 2* | ~65 | 28 | 24 | 24 | 23 |
** Metal etching solutions 1 and 2 are different proportions of phosphoric acid, nitric acid and glacial acetic acid, mainly used for aluminum etching
Product Safety and Disposal
The SY-9406 surfactant is used in semiconductor wafer fabs and the manufacturing of solar cells and flat panel displays. The recommended disposal method is high-temperature incineration at facilities capable of handling halogenated materials. It is essential to prevent the release of SY-9406 surfactant into the environment. Preventive measures include, but are not limited to, handling aqueous waste streams containing the surfactant. For additional product safety and handling information, please read the product label and Material Safety Data Sheet (MSDS) before using this product.