SY-1101 Software Solder Flux

Product Introduction

Flux is one of the important auxiliary materials in the electronics industry. It affects the quality and reliability of electronic products in the electronic assembly process. With the rapid development of the modern information electronics industry, especially the requirements of lead-free solder, higher requirements are put forward for flux. The wettability of lead-free solder alloy is worse than that of lead-containing solder, so the expansion rate is relatively low. Therefore, improving the performance of flux, suitable for the requirements of lead-free solder, and improving the expansion rate have become one of the important criteria for measuring flux.

Adding a certain amount of surfactant to the flux formula can improve the expansion rate. Traditional surfactant hydrocarbon surfactants such as TX-10 are often used, but because its surface activity is only 30dyn/cm, the expansion rate is insufficient in the application of lead-free solder. Fluorine surfactants have natural advantages in reducing the surface tension of liquids and the interfacial tension between liquids and solids, and can effectively improve the expansion rate.

SY-1101 is a fluorine surfactant used in flux. It can effectively reduce the surface tension of alcohol-water system to 20dyn/cm and increase the expansion rate of flux by more than 10%. It has the characteristics of low dosage and good compatibility with formulation components. It does not contain halogen (free chlorine).

SY-1101 can be used in various formulations of solder paste, flux, etc.

Comparison of the application of different types of surfactants in flux

Physical and chemical indicators

Shelf life: 2 years

Packing specifications: 10kg/barrel 25kg/barrel